Polyimide foam aerogel

PI foam is synthesized into PI aerogel by supercritical process. The product retains the excellent performance of PI foam, and the thermal conductivity is greatly reduced.

PIA is a three-dimensional cross-linked porous material composed of polymer molecular chains. Combined with the excellent performance of PI and aerogel, PIA not only has the excellent characteristics of PI, but also has the outstanding characteristics of aerogel, such as lightweight, ultra-low density, high specific surface area, low thermal conductivity, low impedance, environmental durability and low dielectric constant. These special properties make PIA materials have excellent application prospects in thermal, electrical, mechanics, acoustics and other fields.

product details

Polyimide foam aerogel advantages

Low thermal conductivity Thermal conductivity ≤0.018

High temperature resistance, high temperature stability Long-term working temperature 300℃, thermal decomposition temperature 550℃

Hydrophobic rate is greater than 98% Long-term use, will not absorb oil smoke stains

Good weather resistance Good acid, alkali and oil resistance

VOC is 0 At 300℃, no volatile gas is released.

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E-cigarette heat insulation sleeve integrated molding scheme
1, the installation process is simplified, production efficiency and product installation consistency is high.
2, eliminate the heat leakage problem at the joint of the winding process, and further improve the heat insulation and thermal stability.
3, no glue bonding, eliminate the high-temperature volatile odor of glue, while taking into account the tight coating.